CLEANING AND DEOXIDISING the preparation of the circuit board surface for the dry film lamination process and prior the solder application.

The film must adhere perfectly to the surface of the plate to ensure that there is no contact failure. The film must adhere perfectly to the laminate surface to avoid missing or incorrect connections during the etching process sequence.

A clean, oxidation-free surface with uniform roughness and minimal reflection properties is therefore required.

It is recommended to use resin bonded flap rollers (SVF, SSF and SUF BIANCO density 10)

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